Hongyu Cai

Hongyu Cai is a Ph.D. student in the Department of Computer Science at Purdue University. He works at the PurSec Lab under the supervision of Prof. Z. Berkay Celik. His research focuses on the security of foundation models and their applications.

Prior to joining Purdue University, he earned a bachelor's degree from Northeastern University in Shenyang, China, in 2020.

Email  /  Google Scholar  /  LinkedIn  /  GitHub  /  Zhihu

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Publications
D-LiFT: Improving LLM-based Decompiler Backend via Code Quality-driven Fine-tuning
Muqi Zou; Hongyu Cai; Hongwei Wu; Zion Leonahenahe Basque; Arslan Khan; Z. Berkay Celik; Antonio Bianchi; Dongyan Xu
arXiv: 2506.10125, 2025
BibTeX / arXiv
Rethinking How to Evaluate Language Model Jailbreak
Hongyu Cai; Arjun Arunasalam; Leo Y Lin; Antonio Bianchi; Z. Berkay Celik
ACM Workshop on Artificial Intelligence and Security (AISec), 2025
BibTeX / arXiv / code / package
A Progressive Transformer for Unifying Binary Code Embedding and Knowledge Transfer
Hanxiao Lu; Hongyu Cai; Yiming Liang; Antonio Bianchi; Z. Berkay Celik
IEEE International Conference on Software Analysis, Evolution and Reengineering (SANER), 2024
BibTeX / DOI
Benchmark to Audit LLM Generated Clinical Notes for Disparities Arising from Biases and Stereotypes
Hongyu Cai; Swetasudha Panda; Naveen Jafer Nizar; Qinlan Shen; Daeja Oxendine; Sumana Srivatsa; Krishnaram Kenthapadi
Annual Conference on Neural Information Processing Systems (NeurIPS) - Workshop, 2024
BibTeX / poster
NN-Baton: DNN Workload Orchestration and Chiplet Granularity Exploration for Multichip Accelerators
Zhanhong Tan; Hongyu Cai; Runpei Dong; Kaisheng Ma
ACM/IEEE Annual International Symposium on Computer Architecture (ISCA), 2021
BibTeX / DOI

Education
Purdue University, West Lafayette, USA, Ph.D. Computer Science (2023 - Present)
University of Massachusetts Amherst, Amherst, USA, Ph.D. Electrical and Computer Engineering (2020 - 2023, transferred to Purdue University)
Northeastern University, Shenyang, China, B.Eng. Computer Science and Technology (2016 - 2020)

Experience
Oracle Labs, Research Assistant (Jun 2024 - Sep 2024), Burlington, USA
MiraclePlus, Industry Research (Jun 2024), formerly Y Combinator China
Intel Corporation, Internship (Jun 2022 - Sep 2022), Santa Clara, USA
Custom Compute Group; Homomorphic Encryption Accelerator
Tsinghua University, Research Assistant (Jun 2020 - Aug 2020), Beijing, China
Institute for Interdisciplinary Information Sciences
Microsoft Research Asia, Research Internship (Jul 2019 - Jun 2020), Beijing, China
Systems and Networking Research Group

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